Features
Powered by dual-socket 3rd Gen Intel® Scalable processors
32 DIMMs and support for a maximum TDP of up to 270 W per socket
Optional GPU-optimized design allows four dual-slot GPUs for AI workloads
Up to eight all-flash NVMe™ and four SATA/SAS drives on front panel
Plus 2 optional NVMe™ in rear panel to enable extensive storage and high-throughput performance
Up to nine PCIe® 4.0 slots to enable higher bandwidth and improved data-transfer rates
Flexible onboard LAN-module design to enable four 1 Gb LAN or two 10 Gb LAN options
Flexible air- and liquid-cooling solution to achieve lower power-usage effectiveness (PUE)
And optimized TCO for data centers
Onboard ASUS ASMB10-iKVM for out-of-band management with ASPEED AST2600 controller
Integrated PFR FPGA as the platform Root-of-Trust solution for firmware resiliency
High power efficiency with redundant 2400 W 80 Plus® Platinum power supplies